Multi-chip module
US6281575A · kind A · utility
6Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1999 |
| Grant date | Aug 28, 2001 |
| Priority date | — |
| Expiry date | Jul 7, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.