Non-abrasive conditioning for polishing pads
US6283836A · kind A · utility
5Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 1999 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Mar 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/7788
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for resurfacing a polishing pad using non-abrasive techniques. These techniques include shaving, milling, or planing the upper working surface of the polishing pad using an edged cutting tool to alter the microtexture and micro-topology of the surface to produce a desired surface contour or planarity. This precise conditioning of the microscopic features of the polishing pad surface controls dishing in workpieces during polishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.