UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition
US6284050A · kind A · utility
552Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 1998 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | May 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02271
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultraviolet-assisted chemical vapor deposition system for improving the adhesion, hardness, and thermal stability of organic polymer films deposited on semiconductor wafers is provided. The system includes an ultraviolet lamp and a tube-shaped monomer distribution system positioned over the wafer allowing ultraviolet irradiation of the wafer before, during and/or after deposition. Processes for depositing organic polymer films on semiconductor wafers are also provided. The processes include one or more depositions, one or more ultraviolet exposures, and one or more anneals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.