Metalization outside protective overcoat for improved capacitors and inductors

US6284617A · kind A · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• John P. Erdeljac · Plano, US
• Louis N. Hutter · Richardson, US
• M. Ali Khatibzadeh · Plano, US
• John Kenneth Arch · Richardson, US

Key dates

• Filing date: Feb 2, 2001
• Grant date: Sep 4, 2001
• Expiry date: Feb 2, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/68
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A thick layer of copper is formed on the outside the protective overcoat (PO) which protects an integrated circuit, and forms both an inductor and the upper electrode of a capacitor. Placing this layer outside the PO greatly reduces parasitic capacitances with the substrate in the devices.