Crack free welding of silicon
US6284997A · kind A · utility
12Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2000 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900.degree. C. Then an electric or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a silicon plate (60) which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.