Planar metallized substrate with embedded camber control material and method thereof
US6285080A · kind A · utility
12Cited by
14References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 1998 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Nov 23, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to new planar substrates that are metallized and embedded with material to minimize the camber and method thereof. The invention also relates to the fabrication of multilayer ceramic (MLC) substrates for packaging electronic devices. More particularly, this invention relates to the fabrication of thin and small ceramic substrates which do not need post-sintering processing to control the flatness of the sintered product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.