Method of contacting a chip
US6285562A · kind A · utility
8Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 1999 |
| Grant date | Sep 4, 2001 |
| Priority date | — |
| Expiry date | Sep 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a chip bonding method, first bonding bumps are applied to bonding electrodes of the chip, a first flexible circuit carrier is arranged on the chip, the flexible circuit carrier having cavities which are aligned with the bonding bumps, and second bonding bumps are applied to the first bonding bumps in such a way that bonding areas on the first flexible circuit carrier are in contact with the first and/or second bonding bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.