Polishing pad and method of use thereof
US6287174A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2000 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Feb 4, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/14
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for semiconductor wafers having a polishing surface surrounding at least one wafer non-contact region and a method for disengaging a wafer with the polishing pad is disclosed. The wafer non-contact region(s) are located and dimensioned to provide a location for positioning the wafer prior to disengagement, thereby reducing the cohesion force of the slurry resisting the force used for lifting the wafer from the plane of the polishing pad surface. The invention provides safe disengagement of the wafer with the polishing pad, and is especially useful for polishing apparatus employing vacuum retaining means for holding the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.