Light emitting diode with a metal-coated reflective permanent substrate and the method for manufacturing the same
US6287882A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 1999 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Oct 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
Abstract
A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a metal-coated reflective permanent substrate and then removing the temporary substrate. The reflective metal layer also serves as a bonding agent for bonding the permanent substrate. The bonded LED element and permanent substrate are heated in a wafer bonding tool that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the bonded structure during the heating process to assist the bonding of the permanent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.