Process for applying a molten droplet coating for integrated circuits
US6287985A · kind A · utility
8Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1995 |
| Grant date | Sep 11, 2001 |
| Priority date | — |
| Expiry date | Oct 27, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of forming an opaque coating on an integrated circuit or multichip module. A coating composition is prepared and then heated to a temperature sufficient to transform the coating composition to a molten state. Next, the molten coating composition is applied to a surface of the integrated circuit device to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.