Chip module, in particular for implantation in a smart card body

US6288904A · kind A · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Detlef Houdeau · Langquaid, DE
• Peter Stampka · Burglengenfeld, DE
• Michael Huber · Bad Abbach, DE
• Josef Heitzer · Neutraubling, DE

Key dates

• Filing date: Mar 30, 1999
• Grant date: Sep 11, 2001
• Expiry date: Mar 30, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19043
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.