Chemically active slurry for the polishing of noble metals and method for same
US6290736A · kind A · utility
34Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 9, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Feb 9, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F3/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry and CMP process to polish a noble metal surface is provided. The slurry and polishing process are used to form a damascene, or dual damascene noble metal inlay. Such as inlay is useful is forming an integrated circuit ferroelectric capacitor electrode. The slurry includes a halogen, such as bromine, in a basic aqueous solution to chemically react with the noble metal. With an abrasive added, the slurry is used to polish and remove noble metals from a wafer surface during a CMP process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.