Patent · US Expired

Method for making porous CMP article

US6290883A · kind A · utility

20Cited by
15References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 31, 1999
Grant dateSep 18, 2001
Priority date
Expiry dateAug 31, 2019

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C44/3446
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method and apparatus for making a chemical mechanical polishing (CMP) article dissolves gas into solidifiable material, and reduces pressure on the solidifiable material to form gas bubbles therein while solidifying the solidifiable material to make a matrix with voids therein. The gas bubbles are preferably formed to define voids interconnected with adjacent voids to thereby define a porous matrix. The porous matrix ensures uniform distribution of the CMP slurry for greater polishing uniformity. The method produces a CMP pad, for example, with very uniform porosity throughout its thickness so that polishing remains uniform as the pad is consumed in use. The gas and the solidifiable material may preferably be non-reactive with one another. The gas may comprise at least one inert gas, such as nitrogen or argon, for example. The solidifiable material may be a polymer-forming liquid and at least one of a curing and cross-linking agent mixed therein. The polymer-forming liquid may comprise urethane, for example, so that the resulting matrix is polyurethane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.