Microfabricated structures with electrical isolation and interconnections
US6291875A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | May 28, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0828
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention is directed to a microfabricated device. The device includes a substrate that is etched to define mechanical structures at least some of which are anchored laterally to the remainder of the substrate. Electrical isolation at points where mechanical structures are attached to the substrate is provided by filled isolation trenches. Filled trenches may also be used to electrically isolate structure elements from each other at points where mechanical attachment of structure elements is desired. The performance of microelectromechanical devices is improved by 1) having a high-aspect-ratio between vertical and lateral dimensions of the mechanical elements, 2) integrating electronics on the same substrate as the mechanical elements, 3) good electrical isolation among mechanical elements and circuits except where electrical interconnection is desired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.