"Power semiconductor device for ""flip-chip"" connections"
US6291893A · kind A · utility
3Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1999 |
| Grant date | Sep 18, 2001 |
| Priority date | — |
| Expiry date | Jan 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device is formed on a chip of semiconductor material covered by a layer of insulating material. Metal interconnection elements form, on the insulating layer, connection pads to which a soldering material is applied. To permit good heat dissipation, the device has a metal plate partially incorporated in the insulating layer and having a surface which is coplanar with the pads and to which soldering material is applied. The electronic device is secured to a mounting substrate having a corresponding metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.