Method and device for the application of a liquid substance
US6293317A · kind A · utility
2Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2000 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Mar 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for the application of a liquid substance has a baseplate, in which at least one cavity is recessed, and a container. In operation, the container and the baseplate are moved relative to each other in such a way that during the relative movement the container passes from one side of the cavity to the other side of the cavity. Such a device is particularly suitable for the application of flux, electrically conducting epoxy or soldering paste onto the bumps of a semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.