ESEC, Trading SA
38Patents
0Active
38Granted
30Portfolio score
Filing activity: Mar 27, 2000 → Jun 8, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6935539B2 | Device for the metered delivery of a viscous liquid | Mechanical Engineering; Lighting; Heating | 20 | Expired |
| US6705845B2 | Device for the metered delivery of a viscous liquid | Mechanical Engineering; Lighting; Heating | 19 | Expired |
| US6471110B1 | Method and apparatus for mounting semiconductor chips | Electricity | 11 | Expired |
| US6460751B1 | Bondhead for a wire bonder | Electricity | 11 | Expired |
| US6516990B2 | Apparatus for making wire connections | Electricity | 9 | Expired |
| US6519840B1 | Apparatus and method for mounting semiconductor chips on a substrate | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6648205B2 | Method for the calibration of a wire bonder | Electricity | 7 | Expired |
| US7146718B2 | Apparatus for mounting semiconductors | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6435492B1 | Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate | Electricity | 6 | Expired |
| US6821375B2 | Method and apparatus for mounting semiconductor chips onto a flexible substrate | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6581436B2 | Pressure sensor with means for re-calibration | Physics | 5 | Expired |
| US7120995B2 | Apparatus for mounting semiconductors | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6929168B2 | Method for determining optimum bonding parameters for bonding with a wire bonder | Electricity | 4 | Expired |
| US6648215B2 | Method and apparatus for mounting semiconductor chips | Electricity | 4 | Expired |
| US6675465B2 | Pick-up tool | Emerging Cross-Sectional Technologies | 3 | Expired |
| US6857554B2 | Method and device for determining the vectorial distance between the capillary and the image recognition system of a wire bonder | Electricity | 3 | Expired |
| US7284318B2 | Apparatus for mounting semiconductor chips | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7159751B2 | Wire bonder | Electricity | 2 | Expired |
| US7020954B2 | Apparatus for placing a semiconductor chip as a flipchip on a substrate | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6739496B2 | Method for the calibration of a wire bonder | Electricity | 2 | Expired |
| US6571461B2 | Linear guide with an air bearing having provision for heating a support element of the linear guide to maintain fluid gap | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6293317A | Method and device for the application of a liquid substance | Electricity | 2 | Expired |
| US6839958B2 | Apparatus for mounting semiconductor chips | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7004372B2 | Method for determining optimum bond parameters when bonding with a wire bonder | Electricity | 2 | Expired |
| US6530146B2 | Apparatus for mounting a flipchip on a work piece | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.