System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
US6293845A · kind A · utility
25Cited by
19References
21Claims
0Family size
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Key dates
| Filing date | Sep 4, 1999 |
| Grant date | Sep 25, 2001 |
| Priority date | — |
| Expiry date | Sep 4, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for detecting a planarization endpoint of a semiconductor wafer planarization operation, which includes monitoring a motor current for at least one of a platen motor, a carousel motor and a head motor, performing a Fourier transform of the monitored current to identify periodic oscillations in the current, to ensure that undesirable oscillations in the monitored motor current are minimized, to provide better reliability and higher precision of end-point detection triggering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.