Method for the formation of a planarizing coating film on substrate surface
US6297174A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2001 |
| Grant date | Oct 2, 2001 |
| Priority date | — |
| Expiry date | Jan 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is disclosed for the formation of a planarizing coating film on the surface of a substrate having a stepped level difference under processing for the manufacture of semiconductor devices. The inventive method capable of giving a planarizing coating film of excellent planarity and good adhesion to the substrate surface comprises the steps of: PA1 (a) coating the substrate surface with a coating solution containing, as a film-forming solute uniformly dissolved in an ,organic solvent, a nitrogen-containing organic compound such as benzoguanamine and melamine having, in a molecule, at least two amino and/or imino groups each substituted for the nitrogen-bonded hydrogen atom by a hydroxyalkyl group or an alkoxyalkyl group to form a coating layer; PA1 (b) drying the coating layer by evaporating the organic solvent to form a dried coating layer; and PA1 (c) subjecting the dried coating layer to a baking treatment at a temperature in the range from 150 to 250.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.