Circuit configuration with a temperature-dependent semiconductor component test and repair logic circuit

US6297995A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Roderick Mc Connell · Hersbruck, DE
• Detlev Richter · Unterhaching, DE

Key dates

• Filing date: Nov 15, 1999
• Grant date: Oct 2, 2001
• Expiry date: Nov 15, 2019

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/30
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A circuit configuration with a temperature-dependent semiconductor component self-test and repair logic circuit, in which at least one temperature sensor is provided in a semiconductor chip having a semiconductor component. In addition, the semiconductor component is connected in the semiconductor chip with the self-test and repair logic circuit.