Apparatus and method for removing a polishing pad from a platen
US6299519A · kind A · utility
6Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1999 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Aug 3, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for removing a polishing pad from a platen during a CMP process is disclosed. The invention facilitates the removal of a polishing pad from a platen by providing a polishing pad having at least one protuberance portion extending from the main portion of the pad such that the polishing pad may be removed manually or with the assistance of a device by engaging the protuberance portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.