Sputtering assembly and target therefor
US6299740A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2000 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Jan 19, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/35
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A cathode assembly includes a monolithic target having a first surface and a center region. In addition, a sculpted section is formed in the first surface, and the sculpted section is generally recessed from the first surface and extends around the center in a racetrack configuration. The racetrack has a concentric centerline, and the sculpted section preferably is generally symmetric about the centerline. A magnetic field generator is disposed adjacent to the target and produces a magnetic field having an in-plane component. The magnetic field generator is tuned so that a distribution of the magnitude of the in-plane component in a direction transverse to the centerline at a point along the racetrack is characterized by two peaks that have a generally equal magnitude.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.