Photosensitive polymers and chemically amplified photoresist compositions using the same
US6300036A · kind A · utility
5Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1998 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Dec 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/115
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The compounds are of a class of photosensitive polymers for use in chemically amplified photoresists. These photoresists produce sharp line patterns when exposed with an ArF excimer laser. The polymer composition includes a copolymer and the photoresist composition includes a terpolymer with a photo acid generator. The resulting chemically amplified photoresist compositions have strong resistance to dry etching, possess excellent adhesion to film material, and are capable of being developed using conventional developers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.