Hybrid package including a power MOSFET die and a control and protection circuit die with a smaller sense MOSFET
US6300146A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 14, 2000 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Apr 14, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2017/0806
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power MOSFET die and a logic and protection circuit die are mounted on a common lead frame pad, such as a TO220 lead frame pad. The logic and protection circuit die includes a MOSFET that is connected in parallel with the power MOSFET but which is smaller than the power MOSFET and which dissipates power at a predetermined fraction of that of the power MOSFET. The logic and protection circuit die also includes a temperature sensor that is in close proximity to the MOSFET and determines the temperature of the MOSFET. The die also includes another temperature sensor that is located distant from the MOSFET to determine the temperature of the lead frame. The temperature of the power MOSFET can be determined from the temperature measured by these two sensors and from the ratio of the power dissipated by the two MOSFETs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.