Methods of making compliant interfaces and microelectronic packages using same
US6300254A · kind A · utility
6Cited by
8References
43Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 16, 1999 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Apr 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a compliant interface includes providing a support structure and forming a plurality of compliant pads on the support structure by moving a sheet or mold having apertures toward a layer of flowable composition disposed on the support structure. A method of making a microelectronic package includes juxtaposing a microelectronic element with the compliant interface. Leads are formed between the microelectronic element and the substrate. An encapsulant may be disposed between the microelectronic element and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.