Printed-circuit board having projection electrodes and method for producing the same
US6300576A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1998 |
| Grant date | Oct 9, 2001 |
| Priority date | — |
| Expiry date | Jun 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed-circuit board, especially a multilayer printed-circuit board, with projection electrodes integrated with via hole conductors. Each of the projection electrodes is highly adhesive to a corresponding one of the via hole conductors and has high strength, and thus the production method of the printed-circuit board is simplified. Projection electrodes formed of a cured conducting paste are formed in such a manner that the electrodes are integrated with the via hole conductors which consist of a conducting paste embedded into the via hole formed in an insulating resin substrate to form a printed board. The method for producing a printed-circuit board, includes making via holes that penetrate through a prepreg to whose surface a parting film is applied; filling the via hole with a conducting paste; compressing the prepreg under heat to cure the prepreg and the paste; and then peeling off the film. Thus, projection electrodes with a height corresponding the thickness of the film are formed in a manner such that the projecting electrodes are integrated with the via hole conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.