Edge connectable metal package

US6300673A · kind A · utility

Assignee

• Advanced Interconnect Technologies Limited · MU

Inventors

• Paul R. Hoffman · Exton, US
• James M. Popplewell · Guilford, US
• Jeffrey S. Braden · Livermore, US

Key dates

• Filing date: May 5, 1995
• Grant date: Oct 9, 2001
• Expiry date: May 5, 2015

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device. The opposing end of the interconnection means extends to the package perimeter for interconnection to a socket or brazing to external leads.