Advanced Interconnect Technologies Limited
10Patents
0Active
10Granted
35Portfolio score
Filing activity: Mar 19, 1993 → Sep 6, 2005
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6812552B2 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Emerging Cross-Sectional Technologies | 199 | Expired |
| US7259445B2 | Thermal enhanced package for block mold assembly | Electricity | 74 | Expired |
| US7262491B2 | Die pad for semiconductor packages and methods of making and using same | Electricity | 54 | Expired |
| US6262477A | Ball grid array electronic package | Electricity | 53 | Expired |
| US6300673A | Edge connectable metal package | Electricity | 31 | Expired |
| US7129116B2 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Emerging Cross-Sectional Technologies | 28 | Expired |
| US6777265B2 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Electricity | 24 | Expired |
| US5952719A | Metal ball grid electronic package having improved solder joint | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7247933B2 | Thin multiple semiconductor die package | Electricity | 8 | Expired |
| US7489021B2 | Lead frame with included passive devices | Emerging Cross-Sectional Technologies | 8 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.