Bump bonding apparatus and method
US6302317A · kind A · utility
16Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1999 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Jun 18, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.