Shinji Kanayama
47Patents
11h-index
63Co-inventors
74Inventor score
Filing activity: Jul 29, 1993 → Mar 6, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7353596B2 | Component mounting method | Emerging Cross-Sectional Technologies | 167 | Expired |
| US7797820B2 | Component mounting apparatus | Emerging Cross-Sectional Technologies | 163 | Active |
| US6017812A | Bump bonding method and bump bonding apparatus | Electricity | 71 | Expired |
| US5894657A | Mounting apparatus for electronic component | Emerging Cross-Sectional Technologies | 68 | Expired |
| US5783915A | Linear actuating apparatus | Electricity | 22 | Expired |
| US5854745A | Method and apparatus for mounting electronic component | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6302317A | Bump bonding apparatus and method | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6193136A | Component mounting method and apparatus | Electricity | 13 | Expired |
| US7020953B2 | Apparatus and method for mounting component | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6706130B1 | Method and device for frictional connection and holding tool used for the frictional connection device | Electricity | 12 | Expired |
| US6439447B1 | Bump joining judging device and method, and semiconductor component production device and method | Electricity | 12 | Expired |
| US6467158B1 | Component feeder with load position alignment recognition | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6332268A | Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6467670B2 | Method and apparatus for mounting component | Electricity | 9 | Expired |
| US7014092B2 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7021357B2 | Component mounting apparatus and component mounting method | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6055724A | Method and device for sealing IC chip | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7827677B2 | Component mounting apparatus | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6647616B1 | Bump bonding unit with tray storage and transport apparatuses | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7220922B2 | Electronic component, component mounting equipment, and component mounting method | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5462626A | Method of bonding an external lead and a tool therefor | Electricity | 6 | Expired |
| US6506222B2 | Method and apparatus for mounting component | Electricity | 5 | Expired |
| US6568580B2 | Bump bonding apparatus and method | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7219419B2 | Component mounting apparatus including a polishing device | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6329640A | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.