CMP pad conditioner arrangement and method therefor
US6302771A · kind A · utility
9Cited by
11References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1999 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Apr 1, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to an example embodiment, the present invention comprises a CMP pad conditioner arrangement. An inlet is configured and arranged for receiving treatment elements. A distribution surface is coupled to the inlet and is configured and arranged to disperse the treatment elements. A multitude of outlets are coupled to the distribution surface and are configured and arranged to dispense the treatment elements onto a CMP pad. Benefits of using this embodiment include enhanced pad cleaning, better slurry dispense, improved wafer quality, and faster production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.