Albert H. Liu
6Patents
4h-index
4Co-inventors
39Inventor score
Filing activity: Feb 5, 1998 → Jan 30, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5953200A | Multiple pole electrostatic chuck with self healing mechanism for wafer clamping | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6110794A | Semiconductor having self-aligned, buried etch stop for trench and manufacture thereof | Electricity | 13 | Expired |
| US6302771A | CMP pad conditioner arrangement and method therefor | Performing Operations; Transporting | 9 | Expired |
| US6451698B1 | System and method for preventing electrochemical erosion by depositing a protective film | Electricity | 7 | Expired |
| US6409579B1 | Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6537141B1 | Non-slip polisher head backing film | Performing Operations; Transporting | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.