Method for producing a metal layer with a given thickness

US6303401A · kind A · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Marion Nichterwitz · Dresden, DE
• Alexander Ruf · Dresden, DE

Key dates

• Filing date: Dec 4, 2000
• Grant date: Oct 16, 2001
• Expiry date: Dec 4, 2020

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D7/123
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method for producing a metal layer with a given thickness includes the step of measuring an electrical resistance of the metal layer via connections on a starting layer provided under the metal layer. The resistance measurement is performed during or after the deposition of the metal layer. The layer thickness of the deposited metal layer is determined from the resistance measurement. Depending on the thickness of the already deposited metal layer, the deposition process is continued or repeated until a metal layer with a desired thickness is produced.