Via connector and method of making same
US6303881A · kind A · utility
10Cited by
29References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2000 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Aug 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An insulator substrate or printed circuit board (PCB) having a filled and plated via is provided. The plated via is filled with an electrically conductive fill composition. A conductive cap layer is formed on both ends of the conductive fill composition in the via and the major surfaces of the insulator substrate and can be bonded to a surface mount contact as a land or a pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.