Viasystems, Inc.
🏢 View company profile →19Patents
2Active
19Granted
31Portfolio score
Filing activity: Aug 25, 2000 → Jun 29, 2012 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6713685B1 | Non-circular micro-via | Electricity | 44 | Expired |
| US7316461B2 | Indoor-outdoor equipment enclosure and method for assembling the same | Electricity | 40 | Active |
| US7086707B2 | Indoor-outdoor equipment enclosure and method for assembling the same | Electricity | 30 | Expired |
| US7096555B2 | Closed loop backdrilling system | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6594435B2 | Bending an optical fiber into a backplane | Physics | 11 | Expired |
| US6974036B2 | Corner post and manufacturing process for making same | Electricity | 11 | Expired |
| US6303881A | Via connector and method of making same | Electricity | 10 | Expired |
| US6581202B1 | System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture | Electricity | 8 | Expired |
| US6834131B2 | System and method for integrating optical layers in a PCB for inter-board communications | Electricity | 7 | Expired |
| US6598291B2 | Via connector and method of making same | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7178994B2 | Fiber optic circuit connector | Electricity | 6 | Expired |
| US6782181B2 | Bending an optical fiber into backplane | Physics | 5 | Expired |
| US6818115B2 | System and method for electrolytic plating | Electricity | 4 | Expired |
| US7024086B2 | System and method for integrating optical layers in a PCB for inter-board communications | Electricity | 4 | Expired |
| US7364366B2 | Circuit board assembly having a guide insert | Physics | 3 | Expired |
| US6848840B2 | Fiber optic circuit board connector | Physics | 3 | Expired |
| US6976793B2 | Fiber optic circuit connector | Physics | 3 | Expired |
| US6651324B1 | Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9526184B2 | Circuit board multi-functional hole system and method | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.