Wafer notch polishing machine and method of polishing an orientation notch in a wafer
US6306016A · kind A · utility
10Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2000 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Aug 3, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B27/0084
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The notch polishing machine employs a plurality of polishing tapes which can be sequentially introduced into the notch of a wafer to polish both sides of the notch, i.e. the top and bottom surfaces. Each tape is pulled off a supply reel and passed into a mounting block sized to fit into the wafer notch. Each block is also mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in common to be pivoted between a position angularly disposed relative to the top of the top of the wafer and a position angularly disposed relative to the bottom of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.