Method of molding a bump chip carrier and structure made thereby
US6306685A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2000 |
| Grant date | Oct 23, 2001 |
| Priority date | — |
| Expiry date | Feb 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of molding a bump chip carrier is disclosed, which includes at least the following sequential steps: PA1 a step of applying dry films: applying dry films to the top and bottom surface of a copper base plate having a suitable thickness; PA1 a step of forming a circuit pattern on each one of the dry films: forming a circuit pattern on each one of the dry films by a photo engraving process; PA1 a step of plating: plating variable metals (arranged in a desired sequence) onto each of the circuit patterns to form connection pads and an exothermic passage; PA1 a step of removing the dry films; PA1 a step of mounting and wire-bonding a die: fixedly mounting a die on the copper base plate and bonding the die to the connection pads by wires; PA1 a step of molding: molding the surfaces of the copper base plate on which the die is mounted to form a molding layer; and PA1 a step of removing parts of the copper base plate: etching out of the exposed parts of copper base plate situated on the bottom of the molding layer. Also disclosed is a structure of bump chip carrier made by the foregoing method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.