Wafer transfer device
US6309166A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Jun 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/137
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer apparatus for taking out a wafer from a wafer cassette having grooves on both ends for holding circumferential edges of a plurality of wafers by moving a wafer transfer arm in height directions and back and forth directions relative to the wafer cassette. The apparatus comprises a wafer pushing out mechanism for pushing out a wafer on the back of a wafer inlet/outlet side of the wafer cassette into which the transfer arm is inserted. The wafer pushing out mechanism comprises a pushing pin rotatable when it is in contact with the wafer and a driving mechanism for driving the pushing pin so as to push the wafer from the back of the wafer cassette to the wafer inlet/outlet side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.