Method and apparatus for metal allot sputtering
US6309516A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 1, 2000 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Feb 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3408
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for sputter deposition of metal alloys with improved compositional uniformity is provided, wherein a first, narrow width target is provided with a sputtering surface comprised of a metal alloy including metal elements having different angular distributions of sputtered atoms, and a wider width substrate having a deposition surface is moved past the sputtering surface, whereby the deposition surface traverses all arrival angles of the sputtered atoms thereby compensating for the different angular distributions of the sputtered atoms. The inventive methodology finds particular utility in the manufacture of magnetic and magneto-optical (MO) recording media.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.