Microelectronic components with frangible lead sections
US6309910A · kind A · utility
16Cited by
11References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | May 18, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The lead is formed by depositing a layer of lead forming material over an irregularity provided on a supporting substrate so as to provide a region of altered crystal morphology. The region of altered crystal morphology provides the lead with the weakened region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.