Rapid thermal processing chamber for processing multiple wafers
US6310328A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 10, 1998 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | Dec 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for heating a plurality of semiconductor wafers at the same time includes a thermal processing chamber containing a substrate holder designed to hold from about three to about ten wafers. The thermal processing chamber is surrounded by light energy sources which heat the wafers contained in the chamber. The light energy sources can heat the wafers directly or indirectly. In one embodiment, the thermal processing chamber includes a liner made from a heat conductive material. The light energy sources are used to heat the liner which, in turn, heats the wafers. In an alternative embodiment, energy dispersing plates are placed in between adjacent wafers. Light energy being emitted by the light energy sources enters the energy dispersing members and gets distributed across the surface of adjacent wafers for heating the wafers uniformly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.