Substrate temperature measuring apparatus, substrate temperature measuring method, substrate heating method and heat treatment apparatus
US6311016A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 7, 1999 |
| Grant date | Oct 30, 2001 |
| Priority date | — |
| Expiry date | May 7, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temperature measuring apparatus, for measuring a temperature of a substrate in a heating apparatus heating a substrate by irradiation of light, and a method for measuring a substrate temperature, the measuring apparatus having a thermocouple and a covering member for covering it. The covering member portion covering the thermocouple is made of a material with a high heat conductivity and its excluding the material with a high heat conductivity portion is made of a material with a high light reflection factor respectively, whereby it is possible to accurately measure the temperature of the substrate heated by irradiation light without the measurement being affected by the heating irradiation light and without contaminating the substrate and further, without depending on film thicknesses structure of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.