Pressure sensitive adhesive sheet for producing a chip
US6312800A · kind A · utility
13Cited by
15References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1998 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Feb 6, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31703
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a chip, comprising the steps of: PA1 setting an object to be diced on a pressure sensitive adhesive sheet for producing chip comprising at least one layer of shrinkable film, an expansible film and a pressure sensitive adhesive layer for setting the object; PA1 fixing edges of the pressure sensitive adhesive sheet for producing chip; PA1 dicing the object into chips, and PA1 shrinking the shrinkable film to thereby expand chip spacings. In the process for producing small chips such as semiconductor chips, chip spacings can be expanded without the need to conduct the conventional expansion step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.