Method for COB mounting of electronic chips on a circuit board
US6312962A · kind A · utility
1Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2000 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | May 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for COB mounting of electronic chips on a circuit board includes contact connection of connecting wires and substantially whole-area adhesive bonding of a housing. A chip is partially adhesively bonded on a circuit board in such a way that the chip can be contact-connected and can be removed again without damage to the circuit board. Electronic tests or a burn-in process is performed on the chip. The chip, with a given functionality in a manner that is required for application of the circuit board, is fully adhesively bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.