IC die power connection using canted coil spring
US6313523A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1999 |
| Grant date | Nov 6, 2001 |
| Priority date | — |
| Expiry date | Oct 28, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device assembly according to the present invention may comprise a semiconductor die having at least one contact pad thereon and a package substrate having at least one lead pad thereon. The package substrate is sized to receive the semiconductor die so that the contact pad on the semiconductor die is substantially aligned with the lead pad on the package substrate when the semiconductor die is positioned on the package substrate. A coil spring is positioned between the contact pad on the semiconductor die and the lead pad on the package substrate so that the axis of the coil spring is substantially parallel to the contact pad contained on the semiconductor die and the lead pad contained on the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.