Method and apparatus for chemical mechanical polishing
US6315641A · kind A · utility
8Cited by
8References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 24, 2000 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Mar 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Method and apparatus for chemically mechanically polishing semiconductor substrates with enhanced durability, reliability and polishing effectiveness. In the method of the present invention, the substrate and the pad respectively orbits to guarantee uniform polishing across the substrate in principle. The apparatus of the present invention employing the above method is mechanically stable to enhance process reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.