Method of polishing using multi-oxidizer slurry
US6316366A · kind A · utility
18Cited by
32References
7Claims
0Family size
Assignee
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Key dates
| Filing date | Feb 14, 2000 |
| Grant date | Nov 13, 2001 |
| Priority date | — |
| Expiry date | Feb 14, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical mechanical polishing slurry precursor comprising urea, a second oxidizer, an organic acid, and an abrasive, and a method for using the chemical mechanical polishing slurry precursor to prepare a chemical mechanical polishing slurry with a first oxidizer and thereafter using the slurry to remove titanium, titanium nitride, and an aluminum alloy containing layers from a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.