Patent · US Expired

Apparatus for the thermal treatment of substrates

US6316747A · kind A · utility

8Cited by

9References

11Claims

0Family size

Assignee

Steag RTP Systems GmbH · DE

Inventors

Werner Blersch · Bußmannshausen, DE
Heinrich Walk · Allmendingen, DE

Key dates

Filing date	Oct 6, 2000
Grant date	Nov 13, 2001
Priority date	—
Expiry date	Oct 6, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67115
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus for the thermal treatment of substrates is provided. The apparatus includes a reaction chamber, at least one elongated heat source, and at least one reflection wall that is disposed adjacent to the heat source and serves to reflect at least a portion of the radiation given off thereby. The reflection wall has at least one rib, and the heat source is disposed at an oblique angle to the longitudinal direction of the rib.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.