Heat sink for integrated circuit
US6318451A · kind A · utility
6Cited by
5References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2000 |
| Grant date | Nov 20, 2001 |
| Priority date | — |
| Expiry date | Jun 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink includes a base and a number of fins extending from a top face of the base. A groove is defined in a bottom face of the base opposite the fins for receiving a flip chip of a flip chip processor thereby reducing damage to the flip chip during mounting the heat sink to the flip chip processor. At least one elongate protrusion extends from the base for engaging with an edge of a substrate of the flip chip processor to properly position the heat sink with respect to the flip chip processor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.