Chao-Kun Tseng
14Patents
6h-index
18Co-inventors
59Inventor score
Filing activity: Dec 22, 1998 → Jan 30, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6412546B1 | Heat dissipation device for integrated circuits | Electricity | 32 | Expired |
| US7576291B2 | Key button mechanism and an electronic device using the same | Electricity | 19 | Active |
| US6728107B2 | Mounting assembly for heat sink | Emerging Cross-Sectional Technologies | 16 | Expired |
| US9118140B2 | Chip card holder with protective cover for portable electronic devices | Physics | 9 | Active |
| US6273185A | Heat sink and retainer for electronic integrated devices | Electricity | 6 | Expired |
| US6318451A | Heat sink for integrated circuit | Electricity | 6 | Expired |
| US6321584A | Method and machine for making folded fins for a heat sink | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6317323A | Heat sink assembly for an electrical socket | Electricity | 4 | Expired |
| US6195874A | Folded fin forming method, machine and folded fin obtained therefrom | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6452800B2 | Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket | Emerging Cross-Sectional Technologies | 3 | Expired |
| US8018527B2 | Connecting structure and digital camera module employing the same | Physics | 1 | Active |
| US8111855B2 | Microphone assembly and a portable electronic device using the microphone assembly | Electricity | 1 | Active |
| US8241784B2 | Cover mechanism | Emerging Cross-Sectional Technologies | 0 | Active |
| US6442836B1 | Method of making folded fin | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.